Scientific Committee

Structural Health Monitoring (SHM) is the science and application of embedded sensors to assess the health of a structure. The goal of SHM is to enable engineers to manage the operation of engineered structures throughout their lifecycle through the real-time diagnostic and prognostic capabilities of SHM systems.

SHM is part of the answer to the major environmental and economic challenges facing society to build a sustainable future by:

– Extending the life of critical structures and materials;
– Optimising the operational availability of structures;
– Reducing maintenance costs while improving safety.

To build our future and enlarge our community on SHM, a special attention will be given to offer young professionals an exciting opportunity to interact with experienced SHM experts and to bring their enthusiasm, freshness and in-depth knowledge of the latest technologies.

Scientific Committee

Members of the COFREND’s SHM Scientific Committee

  • Odile Abraham, Gustave Eiffel University
  • Jean Paul Balayssac, LMDC, Toulouse University
  • Olivier Bardoux, Air Liquide
  • David Barnoncel, Ariane Group
  • Pierre Calmon, CEA-List
  • Bastien Chapuis, CEA-List
  • Jérôme Delemontez , EDF
  • Michaël Doehler, Inria
  • Daniela Dragomirescu, LAAS-CNRS
  • John Dumoulin, Apave Infrastructures et Construction
  • Vincent Le Cam, Gustave Eiffel University
  • Gaël Loubet, LAAS-CNRS
  • Nazih Mechbal, ENSAM
  • Laurent Mevel, Inria
  • Emmanuel Moulin, University Polytechnique Hauts-de-France
  • Aurélien Rautureau, Airbus Group
  • Jean Sarete, SGS Industries
  • Rafaël Teloli, Femto-ST
  • Fan Zhang, Cetim

Members of the 12th EWSHM Students & Young Professionals Challenge

  • Odile Abraham, Gustave Eiffel University
  • Bastien Chapuis, CEA-List
  • Daniela Dragomirescu, LAAS-CNRS
  • Gaël Loubet, LAAS-CNRS
  • Nazih Mechbal, ENSAM

International Scientific Committee EWSHM

  • O. Bareille, INSA, France
  • C. Boller, Saarland University, Germany
  • F. Cegla, Imperial College, UK
  • FK. Chang, Stanford University, USA
  • B. Chapuis, CEA-List, France
  • E. Chatzi, Swiss Federal Institute of Technology, Switzerland
  • A. Cicirello, University of Cambridge, UK
  • Á. Cunha, University of Porto, Portugal
  • M. Doehler, Inria, France
  • SD. Fassois, University of Patras, Greece
  • A. Fernández López, UPM, Madrid, Spain
  • V. Giurgiutiu, University of South Carolina, USA
  • B. Glisic, Princeton University, USA
  • Y. Goldfeld, Associate Professor, Technion, Israel
  • A. Güemes, UPM, Spain
  • T. Jankowski, Institute of Fundamental Technological Research, Poland
  • P. Kudela, Polish Academy of Sciences, Gdansk, Poland
  • J. Kullaa, Metropolia University of Applied Sciences, Finland
  • V. Le Cam, Gustave Eiffel University, France
  • N. Mechbal, ENSAM, France
  • V. Memmolo, University of Napoli, Italy
  • L. Mevel, Inria, France
  • J. Moll, Siegen University, Germany
  • LE. Mujica , Universitat Politècnica de Catalunya, Spain
  • E. Niederleithinger, BAM, Berlin, Germany
  • W. Ostachowicz, Polish Academy of Sciences, Poland
  • C. Papadimitriou, University of Thessaly, Greece
  • SG. Pierce, University of Strathclyde, UK
  • MP. Limongelli, Politecnico di Milano, Italy
  • A. Pirrotta, University of Palermo, Italy
  • P. Rizzo, University of Pittsburgh, USA
  • D. Saravanos, University of Patras, Greece
  • H. Sohn, KAIST institute, South Korea
  • WJ. Staszewski, AGH University of Science and Technology, Poland
  • Z. Su, Hong Kong Polytechnic University, HK
  • M. Tur, Tel-Aviv University, Israel
  • T. Uhl, AGH University of Science and Technology, Poland
  • S. Yuan, Nanjing University of Aeronautics and Astronautics, China
  • B. Zima, Gdańsk University of Technology, Poland
  • D. Zonta, University of Trento, Italy

Other partners